משחה טרמית Thermal Grizzly PhaseSheet PTM 50x40x0.2mm TG-PS-50-40 צבע אפור

Thermal Grizzly PhaseSheet PTM

PhaseSheet PTM is a heat transfer pad based on a phase change material (PCM), designed to ensure consistent and reliable thermal contact between sensitive components and the cooling solution.

The pad is rigid at room temperature and therefore easy to install, but when heated it softens and becomes partially liquid. This provides optimal conformity to micro‑irregularities and contact surfaces—similar to a high‑quality thermal paste.

PhaseSheet PTM is electrically non‑conductive, making it safe to use around processors (CPU) and graphics processors (GPU), as well as other electronic components that require thermal stabilization.

The material behaves as a solid in a cool environment and begins to change phase only above approximately 45°C, so thermal performance is maintained even through prolonged heating/cooling cycles.

For especially uniform distribution and minimal layer thickness, a clamping force of approximately 300–400 newtons over the contact area is recommended during assembly.

In its liquid state, PhaseSheet PTM has very low viscosity, and when it resolidifies it contracts slightly—helping to significantly reduce the Pump‑Out effect over time.

The Pump‑Out Effect and Long‑Term Performance Stability

In systems where the cooler base is copper and the CPU or GPU is silicon, differing coefficients of thermal expansion create dynamic thermal stresses. Under load, the heat spreader and cooler base may warp or flatten, then return to their original shape when cooled.

In such scenarios, conventional thermal pastes may gradually be squeezed out of the contact area. Thanks to its controlled phase change and slight contraction upon cooling, PhaseSheet PTM reduces the risk of Pump‑Out and helps maintain consistent heat transfer.

Key Advantages

• High thermal conductivity and immediate surface conformity when heated.

• Long‑term performance stability, even with frequent thermal cycling.

• Extended durability and significant reduction of the Pump‑Out effect.

• Suitable for a wide range of applications: CPU, GPU, and other power components.

• Electrical non‑conductivity for maximum safety around densely packed components.

• Simple, clean installation compared to standard thermal pastes.

Tips for Optimal Use

• Ensure contact surfaces are clean, dry, and smooth before assembly.

• Apply uniform clamping force within the recommended range (approximately 300–400 N) for a thin, effective layer.

• Avoid moving the cooler after the initial tightening to maintain uniform distribution.

• Especially suitable for laptops, gaming consoles, and workstations with variable heat loads.