MAXSUN eSport B850M WIFI ICE
Motherboard form factor: MicroATX, 245×210 mm – ideal for building a compact system without compromising on I/O and performance.
CPU support: AM5 socket compatible with Ryzen 7000/8000/9000 series, with a supported TDP of 88–180 W for stability even under load.
Chipset: Fast AMD B850, ensuring efficient communication between the CPU, memory, and devices.
Memory: Two DDR5 U‑DIMM slots up to 96 GB total, dual‑channel support and OC up to 7800 MHz to maximize bandwidth.
Integrated graphics: Shared memory, HDMI 1.4 up to 4096×2160@30Hz and DisplayPort up to 4096×2160@60Hz for smooth 4K output.
Expansion slots: One PCIe 5.0 x16 slot for modern graphics cards and an additional PCIe 3.0 x1; full compatibility with AMD/NVIDIA/Intel cards.
Audio: Realtek ALC897 codec with three audio jacks and support for front and rear outputs — for clean, accurate sound.
Networking: Realtek 8111H Gigabit LAN, Wi‑Fi 6 (Realtek 8852BE), and Bluetooth 5.2 for fast, stable wireless connectivity.
Storage: Two M.2 slots with PCIe 4.0 (x4/x2) plus two SATA 3.0 ports — providing flexibility for capacity expansion and high speeds.
USB ports: Four USB 3.2 Gen1 ports, two USB 2.0 ports, and one internal header for USB 3.2 Gen1 for the front panel.