Материнская Плата Gigabyte B660M GAMING X AX DDR4 LGA1700 - официальный импортер

073-2241747

Gei Oni 6, Tet Shoping Center, Ashdod

1. Realtek^®&Audio CODEC
2. High Definition Audio
3. 2/4/5.1/7.1-channel
   * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE's website for details on configuring the audio software.
4. Support for S/PDIF Out

Intel^®&Wi-Fi 6 AX200 (For PCB rev. 1.0)

1. WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band
2. BLUETOOTH 5.2
3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate

Intel^®&Wi-Fi 6E AX211 (For PCB rev. 1.1)

1. WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
2. BLUETOOTH 5.2
3. Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
   * Actual data rate may vary depending on environment and equipment.

1. 1 x 24-pin ATX main power connector
2. 1 x 8-pin ATX 12V power connector
3. 1 x CPU fan header
4. 3 x system fan headers
5. 2 x addressable LED strip headers
6. 2 x RGB LED strip headers
7. 2 x M.2 Socket 3 connectors
8. 4 x SATA 6Gb/s connectors
9. 1 x front panel header
10. 1 x front panel audio header
11. 1 x USB Type-C^®&header, with USB 3.2 Gen 2 support
12. 1 x USB 3.2 Gen 1 header
13. 2 x USB 2.0/1.1 headers
14. 1 x S/PDIF Out header
15. 2 x Thunderbolt™ add-in card connectors
16. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
17. 1 x serial port header
18. 1 x reset button
19. 1 x Q-Flash Plus button
20. 1 x reset jumper
21. 1 x Clear CMOS jumper

＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.

1. 3 x USB 3.2 Gen 1 ports
2. 5 x USB 2.0/1.1 ports
3. 2 x SMA antenna connectors (2T2R)
4. 1 x HDMI 2.1 port
5. 1 x DisplayPort
6. 1 x RJ-45 port
7. 3 x audio jacks

1. Support for DDR4&4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) /3200/3000/2933/2666/2400/2133 MHz memory modules
2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
3. Dual channel memory architecture
4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
6. Support for Extreme Memory Profile (XMP) memory modules

CPU:

1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

Chipset:

1. 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
2. 4 x SATA 6Gb/s connectors

Support for RAID 0, RAID 1, RAID 5, and RAID 10

Intel^®&Optane™ Memory Ready
* System acceleration with Intel^®&Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset.

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