Designed for passive cooling from the ground up
The NH-P1 isn’t just a regular heatsink without a fan: it has been designed for fanless operation from the ground up, featuring much thicker, much more widely spaced fins in order to achieve both the mass and the minimal airflow resistance that are required in order to excel in natural convection cooling. | |
| Fanless cooling for high-end CPUs
In fully optimised fanless systems, the NH-P1 is capable of cooling high-end CPUs with low to moderate heat dissipation using natural convection only (see setup guidelines and CPU compatibility list). This makes it ideal for powerful builds that have no moving parts and run absolutely silent. |
Increased performance headroom with extra fan
The NH-P1 can be fitted with an extra 120mm fan such as the near inaudible NF-A12x25 LS-PWM in order to increase its maximum dissipation capacity significantly (see setup guidelines and CPU compatibility list): ideal for short spikes of higher heat loads or semi-passive systems that only start their fans when necessary! | |
| No noise, less dust, 100% fail-proof
Fanless cooling doesn’t only have the advantage of being completely silent: if you’re relying on natural convection only and don’t have case fans pushing air through a case, less dust will accumulate in filters or inside the system. Last but not least, with no moving parts such as fans or pumps that could possibly fail, the NH-P1 is as fail-proof as it can be. |
Asymmetrical layout for optimal PCIe compatibility
As many current motherboards have the top PCIe x16 slot sitting close to the socket, bigger heatsinks tend to block it. Due to its asymmetrical layout, the fin-stack of the NH-P1 is offset towards the upper edge of the motherboard when installed in standard orientation. This allows it to clear the top PCIe x16 slot on most current µATX and ATX motherboards (see motherboards compatibility list). | |
| 100% RAM clearance on LGA1200 and AM4
Due to its asymmetric design, the NH-P1 does not overhang the RAM slots on Intel LGA1200, LGA115x and AMD AM4 based motherboards, which ensures easy access to the modules and 100% compatibility with tall heat-spreaders. On LGA2066, it overhangs the RAM slots on the left-hand side of the socket, so RAM modules should not exceed 45mm in height. |
NT-H2 next-gen thermal compound
In high-end passive cooling, every degree counts. This is why the NH-P1 includes a tube of Noctua’s next-generation NT-H2 thermal compound that provides even better performance than the award-winning NT-H1, allowing you to achieve the best possible passive cooling results. | |
| Soldered interface between heatpipes and fins
With many heatsinks, the fins are press-fitted to the heatpipes. Due to the different thermal expansion coefficients of copper and aluminium, this fit can loosen over years of thermal cycling, which may lead to reduced performance. By contrast, the NH-P1’s fins are soldered to the heatpipes in order to guarantee a superior thermal interface that doesn’t deteriorate even after many years of usage. |
