| Revew | | The performance of the thermal paste depends on various factors such as application method and quality, thickness of the bond line, contact surface quality, overall installation pressure and pressure distribution, heat load or type of sink. Therefore, comparison results may generally vary from one definition to another. Furthermore, specific definitions with their unique characteristics such as the quality of contact between the processor IHS and the cooler base (face sizes, pressure concentration) or installation pressure may favor one thermal compound over the other. |  |  | When comparing impressive pastes like NT-H1 and NT-H2 where the differences may be small in some installations, it is also important to strictly control all parameters and tolerances since otherwise, the margin of error may be larger than the actual performance difference, leading to misleading results. To reduce the margin of error, it is important to perform multiple applications and consider the average results. |
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