| Revew | | Performance of thermal paste depends on various factors such as application method and quality, thickness of the connection line, surface contact quality, mounting pressure including pressure distribution, heat load or cooling type. Therefore, comparison results may generally vary from one definition to another. Furthermore, specific definitions with their unique characteristics such as the quality of contact between the processor IHS and the cooling base (surface sizes, pressure concentration) or mounting pressure may dictate one thermal compound over the other. |  |  | When comparing advanced pastes like NT-H1 and NT-H2 where differences may be small in some installations, it is also important to strictly control all parameters and tolerances since otherwise, the margin of error may be larger than the actual performance difference, leading to misleading results. To reduce the margin of error, it is important to perform multiple applications and consider the average results. |
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