משחה טרמית Thermal Grizzly TG Putty Advance 30g TG-P-A-030-R צבע כחול

Thermal Grizzly TG Putty Advance

Thermal Grizzly’s TG Putty Advance is a new generation thermal filler material that serves as a replacement for traditional thermal pads, designed especially for graphics card modding and upgrades, including replacing pads between the PCB and the cooler.

The material is electrically non-conductive, safe to use around densely packed components, and allows clean, precise fitting even when there are uneven gaps between surfaces.

Because it is a flexible, spreadable material, it can fill height differences and small gaps, achieving continuous thermal contact where fixed-thickness pads struggle to provide full conformity. It is an ideal solution for use on VRAM components, VRM arrays, and peripheral cooling areas on graphics cards, as well as in custom water-cooling projects that require a tailored fit.

In many graphics cards, the factory installs pads of different thicknesses depending on the contact area. During maintenance, replacement, or a switch to water cooling, it is not always possible to replicate those exact thicknesses. With TG Putty, it is easier to bridge the gaps: the material fills the spaces precisely where needed and provides efficient heat conduction without measuring each area individually.

The material spreads easily, can be removed and cleaned with a cloth and a little isopropanol, and maintains its viscosity over time. It is also suitable for use on the back of the card and at the interface between the PCB and the backplate, especially when the gaps are relatively uniform and large.

Note: TG Putty is intended to replace thermal pads around peripheral components and does not replace the thermal paste for the GPU core itself.

How much material should you use?

For a single compact graphics card, a 30 g container of TG Putty will usually be enough for all the required contact points.

On larger cards, such as GeForce RTX 4090 models, a 30 g container typically covers the memory (VRAM) components and the VRM array on the front of the PCB.

On the back of larger cards, the gap between the PCB and the backplate is usually larger and more uniform. In such cases, it is common to use two 30 g containers to fill the spaces completely and evenly.

Application recommendation: Spread an even layer that fills all contact points without creating significant excess, and close the cooler with uniform pressure to achieve optimal thermal contact.